Effective KOH etching prior to modified secco etching for analyzing defects in thin bonded silicon on insulator (SOI) wafers

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 36, Issue 3 SUPPL. B, 1997, Pages 1646-1649

  Mitani, Kiyoshi ^a   Aga, Hiroji ^a   Nakano, Masatake ^a  

^a Shin Etsu Handotai   (Japan)

Author keywords

Bonded SOI; KOH etching; Modified Secco etching; PACE; Touch polishing

Indexed keywords

EID: 0000825059     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.36.1646     Document Type: Article

References (10)

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