Recoil implantation of boron into silicon for ultrashallow junction formation: Modeling, fabrication, and characterization

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 16, Issue 1, 1998, Pages 415-419

  Liu, Henley L ^a   Gearhart, Steven S ^a   Booske, John H ^a   Wang, Wei ^a  

^a UNIVERSITY OF WISCONSIN MADISON   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000773430     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.589823     Document Type: Article

References (14)

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