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Applied Physics Letters

Volumn 59, Issue 2, 1991, Pages 175-177

Activation energy for electromigration in Cu films

(2) Park, C W a Vook, R W a

a SYRACUSE UNIVERSITY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000769065 PISSN: 00036951 EISSN: None Source Type: Journal
DOI: 10.1063/1.106011 Document Type: Article

Times cited : (83)

References (11)

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2
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- (edited by J. M. Poate, K. N. Tu, and J. W. Mayer) (Wiley, New York)
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4
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- 3rd ed
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- Blech, I.A.¹

8
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- (1975) Thin Solid Films , vol.25 , pp. 531
- d’Heurle, F.M.¹ Gangulee, A.²

9
- 0000204618
- (1968) Appl. Phys. Lett. , vol.12 , pp. 201
- Rosenberg, R.¹ Berenbaum, L.²

10
- 0002645302
- (1976) J. Phys. Chem. Solids , vol.37 , pp. 73
- Hummel, R.E.¹ Dehoff, R.T.² Geier, H.J.³

11
- 0000303869
- (1967) J. Phys. Chem. Solids , vol.28 , pp. 347
- Sullivan, G.A.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.