Surface hydrogen-bond components and linear solvation energy relationship parameters

Journal of Adhesion

Volumn 63, Issue 1-3, 1997, Pages 187-198

  Lee, Lieng Huang ^a,b  

^a Chinese Academy of Sciences ^*  (United States)

^b LANZHOU INSTITUTE OF CHEMICAL PHYSICS   (China)

Author keywords

Acid base; Free energy; Hydrogen bonding; Interfacial tension; Lewis acid base; Linear free energy; Polymer; Solvation energy; Surface tension; Work of adhesion

Indexed keywords

EID: 0000659729     PISSN: 00218464     EISSN: None     Source Type: Journal    
DOI: 10.1080/00218469708015220     Document Type: Article

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