Boiling characteristics of cylindrical heaters in saturated, gas saturated, and pure-subcooled fc-72

Journal of Heat Transfer

Volumn 119, Issue 2, 1997, Pages 313-318

  Hong, Y S ^a   Ammerman, C N ^a   You, S M ^a  

^a The University of Texas at Arlington   (United States)

Author keywords

Augmentation and Enhancement; Boiling; Phase Change Phenomena

Indexed keywords

EID: 0000489888     PISSN: 00221481     EISSN: 15288943     Source Type: Journal    
DOI: 10.1115/1.2824225     Document Type: Article

References (19)

1. Ammerman, C. N., You, S. M., and Hong, Y. S., 1996, “Identification of Pool Boiling Heat Transfer Mechanisms From a Wire Immersed in Saturated FC-72
2. Using a Single-Photo/LDA Method” ASME Journal of Heat Transfer, Vol. 118, pp. 117-123.
3. Carey, V. P., 1992, Liquid-Vapor Phase-Change Phenomena. Hemisphere, Washington, pp. 225.
4. Carvalho, R. D. M., and Bergles, A. E., 1990, “The Influence of Subcooling on the Pool Nucleate Boiling and Critical Heat Flux of Simulated Electronic Chips” Proceedings of the 9th International Heat Transfer Conference, Jerusalem, pp. 289-294.
5. Judd, R. L., and Hwang, K. S., 1976, “A Comprehensive Model for Nucleate Pool Boiling Heat Transfer Including Microlayer Evaporation” ASME Journal of Heat Transfer, Vol. 98, pp. 623-629.
6. Kline, S. J., and McClintock, F. A., 1953, “Describing Uncertainties in SingleSample Experiments” Mechanical Engineering, Vol. 75, pp. 3-8.
7. Kuehn, T. H., and Goldstein, R. J., 1976, “Correlating Equations for Natural Convection Heat Transfer Between Horizontal Circular Cylinders” International Journal of Heat and Mass Transfer, Vol. 19, pp. 1127-1134.
8. McAdams, W. H., Kennel, W. E., Minden, C. S., Carl, R., Picorneü, P. M., and Dew, J. E., 1949, “Heat Transfer at High Rates to Water with Surface Boiling” Industrial and Engineering Chemistry, Vol. 41, No. 9, pp. 1945-1953.
9. Moreno, J. B., Andraka, C. E., Mos, T. A., Cordeiro, P. G., Dudley, V. E., and Rawlinson, K. S., 1993, “First On-Sun Test of a NaK-78 Pool-Boiler Solar Receiver” 28th Intersociety Energy Conversion Engineering Conference: Energy Environment Economics, pp. 2.511-2.518.
10. Mudawar, I., and Anderson, T. M., 1989, “High Flux Electronic Cooling by Means of Pool Boiling-Part I: Parametric Investigation of the Effects of Coolant Variation, Pressurization, Subcooling, and Surface Augmentation” ASME HTD-Vol. III, pp. 25-34.
11. O’Connor, J. P., You, S. M., Chang, J. Y., 1996, “Gas-Saturated Pool Boiling Heat Transfer From Smooth and Micro-Porous Surfaces in FC-72” ASME Journal of Heat Transfer, Vol. 118, pp. 662-667.
12. Product Manual, 1987, Fluorinert Electronic Liquids, Commercial Chemical Products Division, 3M Company, St. Paul, Minnesota.
13. Sun, K. H., and Lienhard, J. H., 1970, “The Peak Pool Boiling Heat Flux on Horizontal Cylinders” International Journal of Heat and Mass Transfer, Vol. 13, pp. 1425-1439.
14. You, S. M., 1990, “Pool Boiling Heat Transfer with Highly-Wetting Dielectric Fluids” Ph.D. thesis, University of Minnesota, Minneapolis, Minnesota.
15. You, S. M., Hong, Y. S., and O’Connor, J. P., 1994, “The Onset of Film Boiling on Small Cylinders: Local Dryout and Hydrodynamic Critical Heat Flux Mechanisms” International Journal of Heat and Mass Transfer, Vol. 37, pp. 2561-2569.
16. You, S. M., Simon, T. W., and Bar-Cohen, A., 1990a, “Experiments on Boiling Incipience with a Highly-Wetting Dielectric Fluid: Effects of Pressure, Subcooling and Dissolved Gas Content” Heat Transfer 1990, Vol. 2, pp. 337-342.
17. You, S. M., Simon, T. W., and Bar-Cohen, A., 1990b, “Experiments on Nucleate Boiling Heat Transfer with a Highly-Wetting Dielectric Fluid: Effects of Pressure, Subcooling and Dissolved Gas Content” Cryogenic and Immersion Cooling of Optics and Electronic Equipment, ASME HTD-Vol. 131, pp. 45-52.
18. You, S. M., Simon, T. W., Bar-Cohen, A., and Hong, Y. S., 1995, “Effects of Dissolved Gas Content on Pool Boiling of a Highly Wetting Fluid” ASME Journal of Heat Transfer, Vol. 117, pp. 687-692.
19. Zitz, J. A., and Bergles, A. E., 1993, “immersion Cooling of a Multichip Module by Pool Boiling of FC-86” Advances in Electronic Packaging, EEP-Vol. 42, pp. 917-926.