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Volumn 74, Issue , 1996, Pages
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Modelling of bonding pads and their effect on the high-frequency-noise figure of polysilicon emitter bipolar junction transistors
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Author keywords
[No Author keywords available]
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Indexed keywords
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EID: 0000445144
PISSN: 00084204
EISSN: None
Source Type: Journal
DOI: 10.1139/p96-859 Document Type: Article |
Times cited : (11)
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References (7)
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