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Volumn 74, Issue , 1996, Pages

Modelling of bonding pads and their effect on the high-frequency-noise figure of polysilicon emitter bipolar junction transistors

Author keywords

[No Author keywords available]

Indexed keywords


EID: 0000445144     PISSN: 00084204     EISSN: None     Source Type: Journal    
DOI: 10.1139/p96-859     Document Type: Article
Times cited : (11)

References (7)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.