Phenol-formaldehyde resin curing and bonding under dynamic conditions

Wood Science and Technology

Volumn 30, Issue 6, 1996, Pages 423-442

  Wang, X M ^a   Riedl, B ^b   Geimer, R L ^c   Christiansen, A W ^c  

^a NATIONAL RENEWABLE ENERGY LABORATORY   (United States)

^b UNIVERSITÉ LAVAL   (Canada)

^c FOREST PRODUCTS LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000400032     PISSN: 00437719     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF00244438     Document Type: Article

References (25)

1. American Society for Testing and Materials. 1970: Standard methods of evaluating the properties of wood-based fiber and parade panel materials. ASTM Standard Designation: D1037-64. Philadelphia, PA
2. Back, E. L.; Salmen, N. L. 1982: Glass transitions of wood components hold implications for molding and pulping processes. Tappi 65(7): 107-110
3. Casey, I. J. 1987: Changes in wood flake properties in relation to heat, moisture, and pressure during flakeboard manufacture, M.S. thesis, Virginia Polytechnic Institute and State University, USA
4. Chow, S.-Z. 1969: A kinetic study of the polymerization of phenol-formaldehyde resin in the presence of cellulosic materials. Wood Sci. 1: 215-221
5. Chow, S.-Z.; Hancock, W. V. 1969: Method for determining degree of cure of phenolic resin. Forest Prod. J. 19: 21-29
6. Chow, S.-Z; Mukai, H. N. 1972: Polymerization of phenolic resin at high vapor pressure. Wood Sci. 5: 65-72
7. Christiansen, A. W.; Follenabee, R. A.; Geimer, R. L.; Koutsky, J. A.; Myers, G. E. 1993: Phenol-formaldehyde resin curing and bonding in steam injection pressing. II. Differences between rates of chemical and mechanical responses to resin cure. Holzforschung 47: 76-82
8. Follensbee, R. A. 1990: Using dynamic mechanical analysis to characterize the cure of phenolic resins. Ph.D. thesis, University of Wisconsin-Madison, USA
9. Follensbee, R. A.; Koutsky, J. A.; Christiansen, A. W.; Myers, G. E.; Geimer, R. L. 1993: Development of dynamic mechanical methods to characterize the cure state of phenolic resole resins. J. Appl. Polym. Sci. 47: 1481-1496
10. Geimer, R. L.; Christiansen, A. W. 1994: Adhesive curing and bonding: response to real time conditions. In: Proceedings of Adhesives and Bonded Wood Products Symposium, 19-21 November 1991, Seattle, WA.
11. Geiroer, R. I.; Mahoney, R. I.; Loehnertz, S. P.; Meyer, R. W. 1985: Influence of processinginduced damage on strength of flakes and flakeboards. Research Paper FPL-RP-463. Madison, WI: U.S. Department of Agriculture, Forest Service, Forest Products Laboratory. 15 p
12. Geimer, R. L; Follensbee, R. A.; Christiansen, A. W.; Koutsky, J. A.; Myers, G. E. 1990: Resin characterization. In: Maloney, T. M. (Ed.): Proceedings 24th International Washington State University, Particleboard/Composite Materials Symposium, 3-5 April 1990, Pullman, WA. Pullman, WA: Washington State Univ. pp. 65-83
13. Geimer, R. L.; Johnson, S. A.; Kamke, F. A. 1992: Response of flakeboard properties to changes in steam injection pressing environments. Research Paper FPL-RP-507. Madison, WI: U.S. Department of Agriculture, Forest Service, Forest Products Laboratory. 22 p.
14. Humphrey, P. E.; Ren, S. 1989: Bonding kinetics of thermosetting adhesive systems used in wood-based composities: the combined effect of temperature and moisture content. J. Adhesion Sci. Technol. 3: 397-413
15. Humphrey, P. E.; Zavala, D. 1989: A technique to evaluate the bonding reactivity of thermosetting adhesives. J. Testing and Evaluation 17: 323-328
16. Irle, M. A.; Bolton, A. J. 1988: Physical aspects of wood adhesive bond formation with formaldehyde based adhesives. Part II. Binder physical properties and particleboard durability. Holzforschung 42: 53-58
17. Kamke, F. A.; Casey, L. J. 1988: Fundamentals of flakeboard manufacture: internal-mat conditions. Forest Prod. J. 38: 38-44
18. Kamke, F. A.; Wolcott, M. P. 1991: Fundamentals of flakeboard manufacture: wood-moisture relationships. Wood Sci. Technol. 25: 57-71
19. Mizumachi, H.; Monta, H. 1975: Activation energy of the curing reaction of phenolic resin in the presence of woods. Wood Sci. 7: 256-260
20. Nelson, B. E. 1974: Energy considerations in a surface formed by tensile fracture of a cross-linked polymer. J. Colloid Interface Sci. 47: 595-599
21. SAS Institute, Inc. 1989: SAS/STAT User's Guide. Version 6. Cary, N.C.
22. Troughton, G. E.; Chow, S. 1980: Finger-joining kiln-dried white spruce lumber using the "WFPL method". Forest Prod. J. 30(12): 40-49
23. Wang, X.-M.; Riedl, B.; Christiansen, A. W.; Geimer, R. L. 1994: Differential scanning calorimetry of the effects of temperature and humidity of phenol-formaldehyde resin cure. Polymer 26: 5685-5692
24. Wang, X.-M.; Riedl, B.; Christiansen, A. W.; Geimer, R. L. 1995: The effects of temperature and humidity on phenol-formaldehyde resin bonding. Wood Sci. Technol. 29: 253-266
25. Wolcott, M. P.; Kamke, F. A.; Dillard, D. A. 1990: Fundamentals of flakeboard manufacture: viscoelastic behavior of the wood component. Wood and Fiber Science 22: 545-361