Convection heat transfer in electronic equipment cooling

Journal of Heat Transfer

Volumn 110, Issue 4, 1988, Pages 1097-1112

  Incropera, F P ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

Boiling; Convection; Electronic equipment; Reviews

Indexed keywords

ELECTRONIC EQUIPMENT--COOLING;

CONVECTIVE HEAT TRANSFER;

HEAT TRANSFER;

EID: 0000340765     PISSN: 00221481     EISSN: 15288943     Source Type: Journal    
DOI: 10.1115/1.3250613     Document Type: Article

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119. Sparrow, E. M., and Faghri, M., 1980, -Natural Convection Heat from the Upper Plate of a Colinear, Separated Pair of Vertical Plates,— ASME JOURNAL OF HEAT TRANSFER, Vol. 102, pp. 623-629.
120. Sparrow, E. M., and Prakash, C., 1980, -Enhancement of Natural Convection Heat Transfer by a Staggered Array of Discrete Vertical Plates,— ASME JOURNAL OF HEAT TRANSFER, Vol. 102, pp. 215-220.
121. Sparrow, E. M., Ramsey, J. W., and Altemani, C. A. C., 1980, -Experiments on In-Line Pin Fin Arrays and Performance Comparisons With Staggered Arrays,— ASME JOURNAL OF HEAT TRANSFER, Vol. 102, pp. 44-50.
122. Sparrow, E. M., and Bahrami, P. A., 1980, -Experiments on Natural Convection From Vertical Parallel Plates With Either Open or Closed Edges,— ASME JOURNAL OF HEAT TRANSFER, Vol. 102, pp. 221-227.
123. Sparrow, E. M., and Chrysler, G. M., 1981, -Natural Convection Heat Transfer Coefficients for a Short Horizontal Cylinder Attached to a Vertical Plate,— ASME JOURNAL OF HEAT TRANSFER, Vol. 103, pp. 630-637.
124. Sparrow, E.M., and Hsu, C.F., 1981, -Analytically Determined Fin-Tip Heat Transfer Coefficients,— ASME JOURNAL OF HEAT TRANSFER, Vol. 103, pp.
125. Sparrow, E. M., Cook, D. S., and Chrysler, G. M., 1982a, -Heat Transfer by Natural Convection From an Array of Short Wall Attached Horizontal Cylinders,— ASME JOURNAL OF HEAT TRANSFER, Vol. 104, pp. 125-131.
126. Sparrow, E. M., Niethammer, J. E., and Chaboki, A., 1982b, -Heat Transfer and Pressure-Drop Characteristics of Arrays of Rectangular Modules Encountered in Electronic Equipment,— International Journal of Heat and Mass Transfer, Vol. 25, pp. 961-973.
127. Sparrow, E. M., Vemuri, S. B., and Kadle, D. S., 1983, -Enhanced and Local Heat Transfer, Pressure Drop, and Flow Visualization for Arrays of Block-Like Components,— International Journal of Heat and Mass Transfer, Vol. 26, pp. 689-699.
128. Sparrow, E. M., Yanezmoreno, A. A., and Otis, D. R., Jr., 1984a, -Convective Heat Transfer Response to Height Differences in an Array of Block-Like Electronic Components,— International Journal of Heat and Mass Transfer, Vol. 27, pp. 469-473.
129. Sparrow, E. M., Chrysler, G. M., and Azevedo, L. F., 1984b, -Observed Flow Reversals and Measured-Predicted Nusselt Numbers for Natural Convection in a One-Sided Heated Vertical Channel,— ASME JOURNAL OF HEAT TRANSFER, Vol. 106, pp. 325-332.
130. Sparrow, E. M., and Otis, D. R., 1985, -Duct Flow Heat Transfer at a Smooth Wall Which Faces a Wall Covered by Protuberances,— International Journal of Heat and Mass Transfer, Vol. 28, pp. 1317-1326.
131. Sparrow, E. M., and Vemuri, S. G., 1985, -Natural Convection/Radiation Heat Transfer From Highly Populated Pin Fin Arrays,— ASME JOURNAL OF HEAT TRANSFER, Vol. 107, pp. 190-197.
132. Sparrow, E. M., and Kadle, D. S., 1986, -Effects of Tip-to-Shroud Clearance on Turbulent Heat Transfer From a Shrouded Longitudinal Fin Array,— ASME JOURNAL OF HEAT TRANSFER, Vol. 108, pp. 519-524.
133. Starner, K. E., and McManus, H. N., 1963, -An Experimental Investigation of Free Convection Heat Transfer From Rectangular Fin Arrays,— ASME JOURNAL OF HEAT TRANSFER, Vol. 85, pp. 273-278.
134. Steuber, G. D., and Metzger, D. E., 1986, -Heat Transfer and Pressure Loss Performance for Families of Partial Length Pin Fin Arrays in High Aspect Ratio Rectangular Ducts,— Heat Transfer-1986, Proceedings 8th Int. Heat Transfer Conf., Hemisphere Publishing Corp., Washington, Vol. 6, pp. 2915-2920.
135. Tanasawa, I., Nishio, S., Takano, K., and Miyazaki, H., 1984, -High Performance Surface for Forced Convection Heat Transfer Using Novel Turbulence Promoters,— ASME Paper No. 84-HT-69.
136. Tomimura, T., and Fujii, M., 1987, -Laminar Mixed Convection Heat Transfer Between Parallel Plate With Localized Heat Sources,— Proceedings of the International Symposium on Cooling Technology for Electronic Equipment, Honolulu, HI, Mar. 17-21, pp. 701-715.
137. Tuckerman, D. B., and Pease, R. F., 1981, -High-Performance Heat Sinking for VLSI,— IEEE Electronic Device Letters, Vol. EDL-2, pp. 126-129.
138. Tuckerman, D. B., and Pease, R. F., 1982, -Ultrahigh Thermal Conductance Microstructures for Cooling Integrated Circuits,— Proceedings of 32nd IEEE Electronics Components Conference, pp. 145-149.
139. Turner, B. L., and Flack, R. D., 1980, -Experimental Measurement of Natural Convective Heat Transfer in Rectangular Enclosures With Concentrated Energy Sources,— ASME JOURNAL OF HEAT TRANSFER, Vol. 102, pp. 236-241.
140. Ueda, T., Inoue, M., and Nagatome, S., 1981, -Critical Heat Flux and Droplet Entrainment Rate in Boiling of Falling Liquid Films,— International Journal Heat and Mass Transfer, Vol. 24, pp. 1257-1266.
141. Van Fossen, G. J., Jr., 1981, -Heat Transfer Coefficients for Staggered Arrays of Short Pin Fins,— ASME Paper No. 81-GT-75.
142. Webb, B. W., and Ramadhyani, S., 1985, -Conjugate Heat Transfer in a Channel With Staggered Ribs,— International Journal of Heat and Mass Transfer, Vol. 28, pp. 1679-1687.
143. Welling, J. R., and Wooldridge, C. B., 1965, -Free Convection Heat Transfer From Rectangular Vertical Fins,— ASME JOURNAL OF HEAT TRANSFER, Vol. 87, pp. 439-444.
144. Wirtz, R. A., and Stutzman, R. J., 1982, -Experiments on Free Convection Between Vertical Plates With Symmetric Heating,— ASME JOURNAL OF HEAT TRANSFER, Vol. 104, pp. 501-507.
145. Wirtz, R. A., and Dykshoorn, P., 1984, -Heat Transfer From Arrays of Flat Packs in a Channel Flow,— Proceedings Fourth Annual International Electronics Packaging Conference, pp. 318-326.
146. Yaghoubi, M. A., and Incropera, F. P., 1980, -Analysis of Natural Convection Due to Localized Heating in a Shallow Water Layer,— Numerical Heat Transfer, Vol. 3, pp. 315-330.
147. Yamamoto, H., Udagawa, Y., and Suzuki, M., 1987, -Cooling System for FACOM M-780 Large Scale Computer,— Proceedings of the International Symposium on Cooling for Electronic Equipment, Honolulu, HI, Mar. 17-24, pp. 96-109.
148. Yokono, Y., Sasaki, T., and Ishizuka, M., 1987, -Small Cooling Fin Performances for LSI Packages,— Proceedings of the International Symposium on Cooling Technology for Electronic Equipment, Honolulu, HI, Mar. 17-21, pp. 679-688.
149. Yokouchi, K., Kamerhara, N., and Niwa, K., 1987, -Immersion Cooling for Higher Density Packages,— Proceedings IEEE Electronic Components Conference, Boston, MA, May 11-13, pp. 545-549.
150. Zhang, Z., and Patankar, S. V., 1984, -Influence of Buoyancy on the Vertical Flow and Heat Transfer in a Shrouded Fin Array,— International Journal of Heat and Mass Transfer, Vol. 27, pp. 137-140.
151. Zinnes, A. E., 1970, -The Coupling of Conduction With Laminar Natural Convection From a Vertical Plate With Arbitrary Surface Heating,— ASME JOURNAL OF HEAT TRANSFER, Vol. 92, pp. 528-535.