Humidity-dependent mechanical properties of polyimide films and their use for IC-compatible humidity sensors

Sensors and Actuators, A: Physical

Volumn 53, Issue 1-3, 1996, Pages 330-334

  Sager, Karsten ^a   Schroth, Andreas ^a   Nakladal, Arne ^a   Gerlach, Gerald ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Humidity; Polyimide; Polyimide curing; Simulation; Swelling

Indexed keywords

EID: 0000329641     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/0924-4247(96)01132-6     Document Type: Article

References (6)

1. G. Gerlach and K. Sager, A piezoresistive humidity sensor, Sensors and Actuators A, 43 (1994) 181-184.
2. K. Sager, G. Gerlach, A. Schroth, A. Nakladal and U. Breng, Ein Feuchtesensor mit neuartigem Wirkprinzip, Proc. SENSOR '93, Nuremberg, Germany, 11-14 Oct., 1993, Vol. 4, pp. 113-118.
3. K. Sager, The influence of relative ambient humidity on the characteristics of piezoresistive sensors, Thesis, Dresden University of Technology, 1994 (in German).
4. G.A. Bereir and D.E. Kline, Dynamic mechanical behaviour of polyimide, J. Appl. Polymer Sci., 12 (1968) 593-604.
5. W. Jost et al., Diffusion in Solids, Liquids, and Gases, Academic Press, New York, 3rd edn., 1960.
6. J. Crank, The Mathematics of Diffusion, Clarendon Press, Oxford, 2nd edn., 1976.