Cobalt sputtering target and sputter deposition of Co thin films for cobalt suicide metallization

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 17, Issue 4, 1999, Pages 1904-1910

  Zhang, Hao ^a   Poole, John ^a   Eller, Rick ^a   Keefe, Mark ^a  

^a Tosoh SMD Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BEFORE AND AFTER; CO FILMS; CO THIN FILMS; COBALT SALICIDE; DC MAGNETIC FIELD; FORMATION TEMPERATURE; FOUR-POINT PROBE; IV CHARACTERISTICS; LOW RESISTIVITY; MAGNETIC FLUX INTENSITY; METALLIZATIONS; SELF-ALIGNED; SPUTTER PROCESS; SPUTTERING POWER; SPUTTERING PROCESS; SPUTTERING TARGET; ULTRALARGE SCALE INTEGRATION;

CHEMICAL STABILITY; COBALT COMPOUNDS; DC POWER TRANSMISSION; DEPOSITION; ELECTRIC RESISTANCE; FERROMAGNETIC MATERIALS; FERROMAGNETISM; MAGNETIC FIELDS; MAGNETIC FLUX; MAGNETIC STRUCTURE; RAPID THERMAL ANNEALING; RAPID THERMAL PROCESSING; SHEET RESISTANCE; SILICIDES; SPUTTER DEPOSITION; THIN FILMS; VAPOR DEPOSITION;

COBALT;

EID: 0000297387     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.581702     Document Type: Conference Paper

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