Thermodynamics of Ti in Cu-Ti alloy investigated by the EMF method

Materials Science and Engineering: A

Volumn 269, Issue 1-2, 1999, Pages 104-110

  Wei, Pan ^a   Jie, Lian ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Activity coefficient; Ceramic metal joining; Copper titanium alloy; Thermodynamics

Indexed keywords

ENTHALPY; GIBBS FREE ENERGY; INTERFACES (MATERIALS); OXYGEN SENSORS; PHASE INTERFACES; SOLID ELECTROLYTES; THERMODYNAMICS;

ACTIVITY COEFFICIENTS; CERAMIC-METAL JOINING; INTERFACIAL REACTION LAYERS; RAOULT LAW;

COPPER ALLOYS;

EID: 0000138946     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0921-5093(99)00148-3     Document Type: Article

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