Performance of different etch chemistries on titanium nitride antireflective coating layers and related selectivity and microloading improvements for submicron geometries obtained with a high-density metal etcher

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 15, Issue 3, 1997, Pages 702-706

  Abraham, S C ^a   Gabriel, C T ^b   Zheng, J ^b  

^a LAM RESEARCH CORPORATION   (United States)

^b PHILIPS RESEARCH LABORATORIES   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000129613     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.580805     Document Type: Article

References (6)

1. S. C. Abraham, Lam Research Corporation, published in 1996 ASMC, 12-14 November, 1996, Cambridge, MA.
2. C. T. Gabriel, J. Zheng, and S. C. Abraham, J. Vac. Sci. Technol. (submitted).
3. J. Zheng, A. Sharhram, C. T. Gabriel, J. P. McVittie, and S. C. Abraham, J. Vac. Sci. Technol. (submitted).
4. R. A. Gottscho, D. J. Vitkavage, and C. W. Jurgensen, J. Vac. Sci. Tech nol. B 10, (1992).
5. A. D. Bailey and R. A. Gottscho, Jpn. J. Appl. Phys. 1 1, 2083 (1995).
6. H. C. Jones, R. Bennett, and J. Singh, Proceedings of the 8th Symposium on Plasma Processing (Electrochemical Society, New York, 1990), p 45.